MATEC Web of Conferences

Improvement of the adhesion strength between copper plated layer and resin substrate using a chemically adsorbed monolayer

K. Tsuchiya, T. Ohtake and K. Ogawa

MATEC Web of Conferences, 4 (2013) 05004

Published online: 13 August 2013

DOI: 10.1051/matecconf/20130405004

K. Tsuchiya

T. Ohtake

K. Ogawa

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)