| Issue |
MATEC Web of Conferences
Volume 4, 2013
ICOMF14 – 14th International Conference on Organized Molecular Films (LB 14)
|
|
|---|---|---|
| Article Number | 05004 | |
| Number of page(s) | 4 | |
| Section | Self-Assembly and Nanoscale Organization | |
| DOI | https://doi.org/10.1051/matecconf/20130405004 | |
| Published online | 13 August 2013 | |
Improvement of the adhesion strength between copper plated layer and resin substrate using a chemically adsorbed monolayer
Department of Advanced Materials Science, Graduate School of Engineering, Kagawa University, 2217-20, Hayashi-Cho, Takamatsu, Kagawa, 761-0396, Japan
* e-mail: s12g566@stmail.eng.kagawa-u.ac.jp
With reducing the size and weight of electric devices, high-tensile, light and fine copper wire is demanded. So the production technique of a copper wire plated on a super fiber resin (Vectran film) was researched for improving the adhesion strength between the copper and the resin. In this study, we used the Cu2+ or Pd2+ complex prepared with a chemically adsorbed monolayer (CAM) to improve the adhesion strength between the copper plated layer and the Vectran film. As the result of scotch tape test, it was observed that the adhesion strength between the copper plated layer and Vectran film was improved by the Cu2+ or Pd2+ complex CAM.
© Owned by the authors, published by EDP Sciences, 2013
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