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Cited article:

Effect of microstructural variability on fatigue simulations of solder joints

M. Rebosolan, M. van Soestbergen, J.J.M. Zaal, T. Hauck, A. Dasgupta and B. Chen
Microelectronics Reliability 162 115511 (2024)
https://doi.org/10.1016/j.microrel.2024.115511

Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling

Ramiro Sebastian Vargas Cruz and Viktor Gonda
Metals 15 (1) 17 (2024)
https://doi.org/10.3390/met15010017