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Cited article:

Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP

Wan Zamir Zakwan Wan Zainudin, Tan Chou Yong, Tan Cai Hui, Yap Boon Kar and Wong Yew Hoong
Journal of Materials Science: Materials in Electronics 34 (3) (2023)
https://doi.org/10.1007/s10854-022-09661-0