| Issue |
MATEC Web Conf.
Volume 358, 2022
3rd International Symposium on Mechanics, Structures and Materials Science (MSMS 2022)
|
|
|---|---|---|
| Article Number | 01046 | |
| Number of page(s) | 4 | |
| DOI | https://doi.org/10.1051/matecconf/202235801046 | |
| Published online | 19 May 2022 | |
Preparation and Characterization of High Temperature Resistant Polyimide Films
Zhongshan Polytechnic, Zhongshan, China
* Corresponding author: 63614802@qq.com
To prepare high temperature resistant polyimide thin films, we have discussed the synthesis of high-purity diamine precursors in this study. We have prepared polyamide acid solutions first via two-step solution-based polymerization of heat-resisting diamine and dianhydride, and then obtain polyimides after dehydration during a high temperature curing process. The thermal, mechanical and hygroscopic properties of four polyimides thin films were tested and compared.
© The Authors, published by EDP Sciences, 2022
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.