MATEC Web Conf.
Volume 336, 20212020 2nd International Conference on Computer Science Communication and Network Security (CSCNS2020)
|Number of page(s)||5|
|Section||Industrial Design and Engineering Technology|
|Published online||15 February 2021|
Vision based wafer states detection in front opening unified pod load-port system
1 School of Electronic Information, Jiangsu University of Science and Technology, No. 666 Changhui Road, Zhenjiang, 212003 China
2 SIASUN Robot & Automation CO., Ltd, No.33 Quanyun Road, Shenyang 110169, China
* Corresponding author: email@example.com
In modern integrated circuit manufacturing processes, wafers are always transported from one procedure to another. To reduce the risk of dust, Front Opening Unified Pod (FOUP) load-port system is always adopted. Misplaced wafers should be detected before transported. Traditional methods always fail to detect wafer states correctly. To improve detection accuracy, this paper proposed a vision based method. Wafer overlap and malposition detection approach based on modified YOLO-V3 algorithm was suggested. Experiment results shows superiority of the proposed approach.
© The Authors, published by EDP Sciences, 2021
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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