| Issue |
MATEC Web Conf.
Volume 232, 2018
2018 2nd International Conference on Electronic Information Technology and Computer Engineering (EITCE 2018)
|
|
|---|---|---|
| Article Number | 03002 | |
| Number of page(s) | 4 | |
| Section | Algorithm Study and Mathematical Application | |
| DOI | https://doi.org/10.1051/matecconf/201823203002 | |
| Published online | 19 November 2018 | |
Optimization of Machining Parameters of SiC Single Crystal Cut by Diamond Wire Saw
1
School of Mechatronics Engineering , Henan University of Science and Technology , 471003 Luoyang , China
2
Henan Key Laboratory for Machinery Design and Transmission System, Henan University of Science and Technology, 471003 Luoyang , China
* Corresponding author: alilunxn@163.com
For the process of optimizing the process parameters in the process of cutting the hard and brittle materials such as single-crystal SiC by diamond wire saw, the process parameters such as wire saw speed, workpiece feed speed and workpiece rotation speed are the design variables, and the sawing force and surface roughness are the processing targets by orthogonal experimental design. The grey system theory is introduced to optimize the multi-objective cutting process. According to the experimental data, the grey correlation resolution coefficient is determined. The significant relationship between the processing parameters and the target characteristics is analyzed. The optimal combination of process parameters under multi-target conditions is obtained, namely the workpiece feed rate is 0.025mm/min, the wire saw speed is 1.6m/s, and the workpiece rotating speed is 16r/min.
© The Authors, published by EDP Sciences, 2018
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