| Issue |
MATEC Web Conf.
Volume 218, 2018
The 1st International Conference on Industrial, Electrical and Electronics (ICIEE 2018)
|
|
|---|---|---|
| Article Number | 04026 | |
| Number of page(s) | 5 | |
| Section | Industrial And Engineering Applications | |
| DOI | https://doi.org/10.1051/matecconf/201821804026 | |
| Published online | 26 October 2018 | |
Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG)
1
Graduate Program, Department of Physics, Universitas Indonesia, Jakarta Indonesia
2
Department of Physics, Universitas Indonesia, Jakarta Indonesia
3
School of Medicine and Health Sciences, Atmajaya Chatolic University of Indonesia
4
Mechanical Engineering, Universitas Negeri Jakarta, Jakarta Indonesia
*
Corresponding author: naufal@ui.ac.id
Many hydrophobic metal coatings onto Aluminum have been studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a hydrophobic and high-glossy copper coating onto aluminum substrates. The wettability and gloss could be tuned by the value of current density. With the increase of current deensity, the surface roughness raised, thus resulting in increase of contact angle and decrease of glossiness. When the current density was less than 1 mA/cm2, the coating exhibited good luster and prefered orientation. Lowering the Current density the coating showed different corrossion resistance and good water reppelence.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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