MATEC Web Conf.
Volume 171, 2018The First International Conference on Energy, Power, Petroleum and Petrochemical Engineering (E3PE 2017)
|Number of page(s)||4|
|Section||Chapter 2: Energy Management Systems|
|Published online||04 June 2018|
Cooling Performance of Heat Sinks Used in Electronic Devices
Mechanical an Electrical Departments, School of Engineering, Lebanese International University Beirut, Lebanon
* Correspondence: firstname.lastname@example.org
Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.
Key words: Heat sink / Thermal management / Electronic devices
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
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