This article has an erratum: [erratum]
MATEC Web Conf.
Volume 165, 201812th International Fatigue Congress (FATIGUE 2018)
|Number of page(s)||7|
|Section||Cyclic Deformation Mechanisms and Cyclic Stress-Strain Behavior|
|Published online||25 May 2018|
Fatigue life time modelling of Cu and Au fine wires
Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, Institute for Chemical Technologies and Analytics, TU Wien, 1060 Vienna, Austria
2 Infineon Technologies AG, Neubiberg, Germany
* Corresponding author: email@example.com
In this study, the influence of microstructure on the cyclic behaviour and lifetime of Cu and Au wires with diameters of 25μm in the low and high cycle fatigue regimes was investigated. Low cycle fatigue (LCF) tests were conducted with a load ratio of 0.1 and a strain rate of ~2e-4. An ultrasonic resonance fatigue testing system working at 20 kHz was used to obtain lifetime curves under symmetrical loading conditions up to very high cycle regime (VHCF). In order to obtain a total fatigue life model covering the low to high cycle regime of the thin wires by considering the effects of mean stress, a four parameter lifetime model is proposed. The effect of testing frequency on high cycle fatigue data of Cu is discussed based on analysis of strain rate dependency of the tensile properties with the help of the material model proposed by Johnson and Cook.
© The Authors, published by EDP Sciences, 2018
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
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