| Issue |
MATEC Web Conf.
Volume 140, 2017
2017 International Conference on Emerging Electronic Solutions for IoT (ICEESI 2017)
|
|
|---|---|---|
| Article Number | 01022 | |
| Number of page(s) | 4 | |
| DOI | https://doi.org/10.1051/matecconf/201714001022 | |
| Published online | 11 December 2017 | |
Substrate Integrated Waveguide (SIW) Coupler on Green Material Substrate for Internet of Things (IoT) Applications
Advanced Communication Engineering Centre (ACE) School of Computer and Communication Engineering, Universiti Malaysia Perlis, Arau, Perlis, Malaysia
* Corresponding author: nurehansafwanah@yahoo.com
This paper shows designed coupler on paper-substrate with Substrate Integrated Waveguide (SIW) techniques. Types of paper-substrate that used are photographic paper. The rectangular coupler is presented with Substrate Integrated Waveguide (SIW) which metallic via on paper-substrate. The structures of the coupler are designed and analysed using Computer Simulation Tools (CST) Studio Suite 2014 Software. This designed coupler operating within frequency of 3.8-5 GHz. The paper-based substrates are permits the implementation of green materials (Eco-friendly) technology. The design of the coupler and its simulated results are reported in this paper.
© The Authors, published by EDP Sciences, 2017
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).
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