The measuring technique developed to evaluate the thermal diffusivity of the multi-layered thin film specimens

Department of Mechanical Engineering, National Cheng Kung University, Tainan 701, Taiwan

^* e-mail: TCL92@mail.ncku.edu.tw

Abstract

In the present study, the thermal diffusivities of the Al, Si and ITO films deposited on the SUS304 steel substrate are evaluated via the present technique. Before applying this technique, the temperature for the thin film of the multi-layered specimen is developed theoretically for the one- dimensional steady heat conduction in response to amplitude and frequency of the periodically oscillating temperature imposed by a peltier placed beneath the specimen's substrate. By the thermal-electrical data processing system excluding the lock-in amplifier, the temperature frequency a3 has been proved first to be independent of the electrical voltage applied to the peltier and the contact position of the thermocouples. The experimental data of phase difference for three kinds of specimen are regressed well by a straight line with a slope. Then, the thermal diffusivity of the thin film is thus determined if the slope value and the film- thickness are available. In the present arrangements for the thermocouples, two thermal diffusivity values are quite close each other and valid for every kind of specimen. This technique can provide an efficient, low-cost method for the thermal diffusivity measurements of thin films.