| Issue |
MATEC Web Conf.
Volume 71, 2016
The International Conference on Computing and Precision Engineering (ICCPE 2015)
|
|
|---|---|---|
| Article Number | 04007 | |
| Number of page(s) | 6 | |
| Section | Advanced Manufacturing and Analysis Technology | |
| DOI | https://doi.org/10.1051/matecconf/20167104007 | |
| Published online | 02 August 2016 | |
Fatigue Life Analysis of Cantilever Probe on Wafer Test
1 Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung City 807, Taiwan (R.O.C.)
2 Consultant, Sun Home Technology Co., Ltd
This research utilizes the finite element analysis software (ANSYS) to stimulate the different probe material quality (tungsten, SUS304 stainless steel, SUS316L stainless steel and SKD11 tool steel, respectively) during wafer tests. Under a room temperature of (25°C), the stress and fatigue life (cycles of probing test) of the cantilever probe were measured with an OverDriver (OD) of 20µm, 40µm, 50µm, 60µm and 80µm, respectively. First, to obtain the magnitude of pinpoint shift of the probe under wafer test and the OverDriver is 50µm. And, calculate the fatigue life of the probe. Then, a probe model with the same characteristics as the experiment is created and the probe fatigue life analyzed with the ANSYS. After the reliability of the model is ascertained, the wafer tests of different probe materials are stimulated under different OverDriver circumstances to calculate its stress and fatigue life. The results indicate that the greatest stress measured during the wafer test of the tungsten, SUS304 stainless steel, SUS316L stainless steel and SKD11 tool steel cantilever probe are all smaller than the yield strength, and the fatigue life could reach over one hundred K cycles. When catalogued by the cantilever probe fatigue life during one hundred K cycles, the life span, in order, is tungsten < SUS316L stainless steel < SUS304 stainless steel < SKD11 tool steel.
© The Authors, published by EDP Sciences, 2016
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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