| Issue |
MATEC Web Conf.
Volume 67, 2016
International Symposium on Materials Application and Engineering (SMAE 2016)
|
|
|---|---|---|
| Article Number | 03035 | |
| Number of page(s) | 6 | |
| Section | Chapter 3 Information Technology | |
| DOI | https://doi.org/10.1051/matecconf/20166703035 | |
| Published online | 29 July 2016 | |
Effect of Annealing Treatment on Microstructure of Mg/Cu Diffusion Layer
College of Materials Science and Engineering, Xi’an University of Science and Technology, Xi’an 710054, China
a 18710980374@163.com
b shuangmingdu@163.com
c clhujie2009@163.com
* Corresponding author: 18710980374@163.com
The experimental study of the “mosaic type” Mg/Cu diffusion couple in the argon protection environment was carried out. The microstructure and micro-hardness of the Mg/Cu diffusion layer were analyzed by means of SEM, EDS and micro-hardness tester. The results show that the diffusion behavior of Mg/Cu diffusion couple is influencedby annealing temperature. When the temperature located at 430~450°C, the behavior of element diffusion happened in solid phase, the thickness of diffusion layer increased slowly which was about 5~25um, and the microstructure of diffusion layer from Mg to Copper includes magnesium based solid solution /Mg2Cu/Cu2Mg/ copper based solid solution, the micro-hardness of the diffusion layer was significantly higher than that ofthe two sides, when bonded at 430°C for 4h, the micro-hardness of thediffusion layer was highest that up to 194HV. When the temperatu rereached to 485°C, the thickness of diffusion layer increased significantly which was about 5.3mm because of the formation of eutectic liquid phase reaction zone, and the microstructure of the diffusion layer were magnesium based solid solution /Mg-Cu eutectic/ Cu based solid solution.
© The Authors, published by EDP Sciences, 2016
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