MATEC Web of Conferences
Volume 37, 2015Smart Grids 2015
|Number of page(s)||5|
|Section||Investigation of Power Engineering Processes|
|Published online||22 December 2015|
Change of Dynamic Contact Angle of a Drop Spreading over Copper Surface
1 S. S. Kutateladze Institute of Thermal Physics, Siberian Branch, Russian Academy of Sciences, 630090 Novosibirsk, Russia
2 National Research Tomsk Polytechnic University, 634050 Tomsk, Russia
a Corresponding author: firstname.lastname@example.org
This work presents the comparison between the change of a dynamic contact angle during drop spreading over copper surfaces obtained in the experiment and calculated by using empirical correlations (Bracke et al., Jiang et al., Seebergh et al.). It is found that these correlations are applicable for the case of drop spreading over a smooth surface or over a rough surface into the low capillary number region (2.5·10−7). Dynamic contact angles obtained experimentally increase with increasing capillary number, besides it increases significantly on more rough surfaces. However the calculated values of angles do not depend on Ca.
© Owned by the authors, published by EDP Sciences, 2015
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