MATEC Web of Conferences

Effect of ECAP process on deformability, microstructure and conductivity of AA5083 under thermal effect

Nagendra Singh and Manoj Kumar Agrawal

MATEC Web Conf., 392 (2024) 01028

Published online: 18 March 2024

DOI: 10.1051/matecconf/202439201028

Nagendra Singh

Manoj Kumar Agrawal

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