MATEC Web of Conferences

Investigation on Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for Power QFN Application

Gunaseelan Chandrakasan and Mark Ovinis

MATEC Web of Conferences, 51 (2016) 03009

Published online: 06 April 2016

DOI: 10.1051/matecconf/20165103009

Gunaseelan Chandrakasan

Mark Ovinis

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