MATEC Web of Conferences

Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author’s Work

D. Sujan, L. Vincent and Y. W. Pok

MATEC Web Conf., 202 (2018) 01006

Published online: 26 September 2018

DOI: 10.1051/matecconf/201820201006

D. Sujan

L. Vincent

Y. W. Pok

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