Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based SolderGuoqian Mu, Wenqing Qu, Xixiao Lv and Hongshou ZhuangMATEC Web Conf., 269 (2019) 02005DOI: https://doi.org/10.1051/matecconf/201926902005