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Solution for the Drift Problem of the Chip in the Packaging Process

Shaohua Dong, Yueyang Liu, Rui Jin, Guoqing Leng, Feng He, Jiang Liu, Yan Pan and Junmin Wu

MATEC Web Conf., 232 (2018) 04044

DOI: https://doi.org/10.1051/matecconf/201823204044

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