Articles citing this article

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Cited article:

Development of solderable layer on power MOSFET for double-side bonding

Dajung Kim, Mi So Won, Jeongki Jang, Sooseong Kim and Chulmin Oh
Microelectronics Reliability 129 114482 (2022)
https://doi.org/10.1016/j.microrel.2022.114482

Minimizing spring-back and thinning in deep drawing process of St14 steel sheets

Seyed Jalal Hashemi and Amir H. Roohi
International Journal on Interactive Design and Manufacturing (IJIDeM) 16 (1) 381 (2022)
https://doi.org/10.1007/s12008-021-00816-7

Effect of temperature on the deep drawing forming performance of Ti/Al laminates: experimental investigation and finite element analysis

Hantao Kou, Liang Qin, Ali Abd El-Aty, et al.
The International Journal of Advanced Manufacturing Technology 114 (9-10) 2617 (2021)
https://doi.org/10.1007/s00170-021-06892-z

Finite element simulation of the dynamic behaviour of deep drawn components with accurate thickness description

F. Greco, E. Deckers, J. Stroobants, et al.
Finite Elements in Analysis and Design 138 12 (2018)
https://doi.org/10.1016/j.finel.2017.10.004

Feature Size Effect on Formability of Multilayer Metal Composite Sheets under Microscale Laser Flexible Forming

Huixia Liu, Wenhao Zhang, Jenn-Terng Gau, Zongbao Shen, Youjuan Ma, Guoce Zhang and Xiao Wang
Metals 7 (7) 275 (2017)
https://doi.org/10.3390/met7070275