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Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

Van Nhat Le, Lahouari Benabou, Victor Etgens and Quang Bang Tao
Microelectronics Reliability 65 243 (2016)
DOI: 10.1016/j.microrel.2016.07.098
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Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Van-Nhat Le, Lahouari Benabou, Quang-Bang Tao and Victor Etgens
International Journal of Solids and Structures 106-107 1 (2017)
DOI: 10.1016/j.ijsolstr.2016.12.003
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Van-Nhat Le, Lahouari Benabou and Quang-Bang Tao
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Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

Aleksander Sesek, Olga Chambers and Janez Trontelj
Journal of Electronic Packaging 141 (2) (2019)
DOI: 10.1115/1.4042804
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