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Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

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Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

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Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy

V.N. Le, L. Benabou, V. Etgens and Q.B. Tao
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