Articles citing this article

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Cited article:

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar and Mohamad Riduwan Ramli
Journal of Electronic Packaging 147 (1) (2025)
https://doi.org/10.1115/1.4065805

Investigating the impacts of heat sink design parameters on heat dissipation performance of semiconductor packages

Rilwan Kayode Apalowo, Aizat Abas, Muhammad Razin Salim, Mohamed Fikri Mohd Sharif and Chia Siang Kok
International Journal of Thermal Sciences 208 109490 (2025)
https://doi.org/10.1016/j.ijthermalsci.2024.109490

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Fakhrozi Che Ani, Muhamed Abdul Fatah Muhamed Mukhtar and Mohamad Riduwan Ramli
Soldering & Surface Mount Technology 36 (3) 154 (2024)
https://doi.org/10.1108/SSMT-12-2023-0075

Global–local model for three-dimensional guided wave scattering with application to rail flaw detection

Antonino Spada, Margherita Capriotti and Francesco Lanza di Scalea
Structural Health Monitoring 21 (2) 370 (2022)
https://doi.org/10.1177/14759217211000863