MATEC Web of Conferences

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Niwat Mookam and Kannachai Kanlayasiri

MATEC Web Conf., 192 (2018) 01024

Published online: 14 August 2018

DOI: 10.1051/matecconf/201819201024

Niwat Mookam

Kannachai Kanlayasiri

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