MATEC Web of Conferences

Warpage behavior analysis in package processes of embedded copper substrates

Yeong-Maw Hwang, Tsang-Hung Ou and Wei-Hung Su

MATEC Web Conf., 123 (2017) 00014

Published online: 21 September 2017

DOI: 10.1051/matecconf/201712300014

Yeong-Maw Hwang

Tsang-Hung Ou

Wei-Hung Su

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