MATEC Web of Conferences

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Lahouari Benabou, Van Nhat Le, Zhidan Sun, Philippe Pougnet and Victor Etgens

MATEC Web of Conferences, 12 (2014) 04026

Published online: 09 June 2014

DOI: 10.1051/matecconf/20141204026

Lahouari Benabou

Van Nhat Le

Zhidan Sun

Philippe Pougnet

Victor Etgens

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)