Automatic Semiconductor Wafer Image Segmentation for Defect Detection Using Multilevel Thresholding
MATEC Web Conf., 78 (2016) 01103
Published online: 2016-10-07
Articles citing this article
The Citing articles tool gives a list of articles citing the current article.
The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).
Cited article:
This article has been cited by the following article(s):
MFSF-Net:A multi-scale feature and side-outputs fusion network for pixelwise catastrophic optical damage detection
Shuai Guo, Dengao Li, Jumin Zhao, Bao Tang and Biao LuoIEEE Transactions on Instrumentation and Measurement 1 (2024)
https://doi.org/10.1109/TIM.2024.3381277
Research on surface defect detection system and method of train bearing cylindrical roller based on surface scanning
Yudong Bao, Zhentao Zhou, Siming Wei and Jingzhong XiangJournal of Mechanical Science and Technology 37 (9) 4507 (2023)
https://doi.org/10.1007/s12206-023-0808-8
Detection of Surface Defects of Magnetic Tiles Based on Improved YOLOv5
Yan Li, Juanyan Fang and Yunchao TangJournal of Sensors 2023 (1) (2023)
https://doi.org/10.1155/2023/2466107
Online recognition of magnetic tile defects based on UPM-DenseNet
Cong Hu, Haiwen Liao, Tian Zhou, Aijun Zhu and Chuanpei XuMaterials Today Communications 30 103105 (2022)
https://doi.org/10.1016/j.mtcomm.2021.103105
A CAM-Based Weakly Supervised Method for Surface Defect Inspection
Xiaojun Wu, Tuo Wang, Yiming Li, Peng Li and Yunhui LiuIEEE Transactions on Instrumentation and Measurement 71 1 (2022)
https://doi.org/10.1109/TIM.2022.3168895
A strip steel surface defect detection method based on attention mechanism and multi-scale maxpooling
Ming Tang, Yuanyuan Li, Wei Yao, Lingyu Hou, Qichun Sun and Jiahang ChenMeasurement Science and Technology 32 (11) 115401 (2021)
https://doi.org/10.1088/1361-6501/ac0ca8
A Novel Method Based on Deep Convolutional Neural Networks for Wafer Semiconductor Surface Defect Inspection
Guojun Wen, Zhijun Gao, Qi Cai, Yudan Wang and Shuang MeiIEEE Transactions on Instrumentation and Measurement 69 (12) 9668 (2020)
https://doi.org/10.1109/TIM.2020.3007292