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Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition

Rita Mohd Said, Norainiza Saud, Norhayanti Mohd Nasir, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman and Mohd Izrul Izwan Ramli
IOP Conference Series: Materials Science and Engineering 701 (1) 012046 (2019)
DOI: 10.1088/1757-899X/701/1/012046
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Montajar Sarkar, Fahmida Gulshan, Abu Raihan Md. Harunur Rashid and Muhammad Hasanuzzaman
DOI: 10.1016/B978-0-12-819728-8.00002-4
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