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Cited article:

Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

M.I.I. Ramli, M.A.A. Mohd Salleh, M.N. Derman, R.M. Said, N. Saud

MATEC Web Conf., 78 (2016) 01064

Published online: 2016-10-07

DOI: https://doi.org/10.1051/matecconf/20167801064

This article has been cited by the following article(s):

Fracture behaviour of Sn-58Bi alloy reinforced by activated bamboo charcoal

Karen Mee Chu Wong, Jing Yee Chai, Muhammad Mahyiddin Ramli, Boon Han Lim, Siew Hoong Shuit, N.M. Noor and S.Y. Yusuf
E3S Web of Conferences 589 03008 (2024)
https://doi.org/10.1051/e3sconf/202458903008

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

Siti Faqihah Roduan, Juyana A. Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu and Petrica Vizureanu
Materials 16 (1) 96 (2022)
https://doi.org/10.3390/ma16010096