Articles citing this article

The Citing articles tool gives a list of articles citing the current article.
The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).

Cited article:

This article has been cited by the following article(s):

Matthias Zeppenfeld, Benedikt Müller and Sophia Heyl
2139 030005 (2019)
DOI: 10.1063/1.5121658
See this article

Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems

Tobias Kleffel and Dietmar Drummer
Journal of Polymer Engineering 38 (7) 675 (2018)
DOI: 10.1515/polyeng-2017-0432
See this article

Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding

Constantin Ott and Dietmar Drummer
Polymer Engineering & Science (2021)
DOI: 10.1002/pen.25672
See this article

Analysis of the formation of gap-based leakages in polymer-metal electronic systems with labyrinth seals

Tobias Kleffel, Philipp Frey, Marion Merklein and Dietmar Drummer
Journal of Polymer Engineering 39 (6) 573 (2019)
DOI: 10.1515/polyeng-2019-0098
See this article