Open Access
MATEC Web of Conferences
Volume 7, 2013
JA 2013 – Journées Annuelles de la SF2M 2013 / SF2M Annual Meeting 2013
Article Number 02015
Number of page(s) 2
Section Colloque 2 : Assemblages, Soudage et Collage / Joining, Welding and Sticking
Published online 07 November 2013
  1. L. Sun, S. Pang, A. Sterling, M. Stubblefield, Dynamic analysis of curing process of Epoxy Prepreg, J. App. Polym. Sci 2002.
  2. Kissinger, Reaction kinetics in differential thermal analysis, Anal. Chem 1957.
  3. J. Maurice, J.Y. Cognard, R. Créac'hcadec, P. Davies, L. Sohier, S. Mahdi, Characterization and modelling of the 3D elastic-plastic behaviour of an adhesively bonded joint under monotonic tension/compression-shear loads : influence of three cure cycles, J. of Adhes. Sci. and Technol., 2012.