An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibah, 02600 Jejawi, Arau, Perlis, Malaysia
* Corresponding author: firstname.lastname@example.org
In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.
© The Authors, published by EDP Sciences, 2016
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