Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia.
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The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
© The Authors, published by EDP Sciences, 2016
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