Solving Problem of Thermal Conduction for Providing Strength of Electronic Units on Thermal Impacts
1 Khmelnitskiy National University, Drawing and Graphic Design Department, 29016 11 Institutska Str., Khmelnitskiy, Ukraine
2 Khmelnitskiy National University, Radio Engineering and Communication Department, 29016 11 Institutska Str., Khmelnitskiy, Ukraine
* Corresponding author: email@example.com
Paper represents new approach to physical and mathematical modeling of thermal fields distribution in sealed electronic units on the base of introducing “effective parameters” of the system. Effectiveness of developed mathematical model and its computer implementing are demonstrated on the example of standard unit sealed by compound.
© The Authors, published by EDP Sciences, 2016
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