Using AlN-Coated Heat Sink to Improve the Heat Dissipation of LED Packages
1 School of Mechanical and Automotive Engineering/FuJian University of Technology, Fuzhou 350118, China
2 School of Nursing/National Taipei University of Nursing and Health Science, Taipei 11219, Taiwan
* Corresponding author: firstname.lastname@example.org
This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of light-emitting diode (LED) packages. AlN coatings are grown on copper/ aluminum substrates as a heat interface material, using an electrostatic spraying process. The effect of the deposition parameters on the coatings is determined. The thermal performance of AlN coated Cu/Al substrates is evaluated in terms of the heat dissipated and compared by measuring the LED case temperature. The structure and properties of the coating are also examined a scanning electron microscopy (SEM). In sum, the thermal performance of the LED is increased and good heat resistance characteristics are obtained. The results show that using AlN ceramic coating on a copper/aluminum substrate increases the thermal performance.
© The Authors, published by EDP Sciences, 2016
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