Microstructure evolution and surface cleaning of Cu nanoparticles during micro-forming fields activated sintering technology
1 School of Manufacturing Science and Engineering, Sichuan University, Chengdu, Sichuan 610065, PR China
2 Department of Design, Manufacture and Engineering Management, University of Strathclyde, James Weir Building, 75 Montrose Street, Glasgow G1 1XQ, UK
a Corresponding author: e-mail: firstname.lastname@example.org
For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.
© Owned by the authors, published by EDP Sciences, 2015
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.