Effects of voids on thermal-mechanical reliability of lead-free solder joints
1 LISV, University of Versailles Saint Quentin-en-Yvelines, 78035 Versailles, France
2 VALEO, Powertrain Systems, 95892 Cergy Pontoise, France
a Corresponding author: firstname.lastname@example.org
Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.
© Owned by the authors, published by EDP Sciences, 2014
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