Scaling of black silicon processing time by high repetition rate femtosecond lasers
1 Center for Nano Science and Technology@PoliMi, Istituto Italiano di Tecnologia, Via Giovanni Pascoli, 70/3, 20133, Milan, Italy
2 Dipartimento di Fisica, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milan, Italy
3 Istituto di Fotonica e Nanotecnologie – CNR, Piazza Leonardo da Vinci 32, 20133, Milan, Italy
* e-mail: Krishna.Vishunubhatla@iit.it
Surface texturing of silicon substrates is performed by femtosecond laser irradiation at high repetition rates. Various fabrication parameters are optimized in order to achieve very high absorptance in the visible region from the micro-structured silicon wafer as compared to the unstructured one. A 70-fold reduction of the processing time is demonstrated by increasing the laser repetition rate from 1 kHz to 200 kHz. Further scaling up to 1 MHz can be foreseen.
© Owned by the authors, published by EDP Sciences, 2013
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